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2026
TaiwanEurope

Chip InnovationForum

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Collaboration Models

Between Taiwan and Europe for IC Design

1/5

Industry Session for Day 1

This key industry component sections the entire value chain from Taiwan and Europe in the fields of R&D, design, manufacturing, and applications. Will be important participants and experience sharers for IDM, Korea Fundernoise, TSMC, owns, and EUROPRACTICE etc, who also share their past approaches and experiences in serving Taiwanese and European industries and academic partners. More importantly, they will propose support programs tailored to the future needs of the industry.

Exploring Future Innovations and Taiwan-Europe Collaborations
Industry Session for Day 2

This key industry component sections the entire value chain from Taiwan and Europe in the fields of R&D, design, manufacturing, and applications. Will be important participants and experience sharers for IDM, Korea Fundernoise, TSMC, owns, and EUROPRACTICE etc, who also share their past approaches and experiences in serving Taiwanese and European industries and academic partners. More importantly, they will propose support programs tailored to the future needs of the industry.

Shaping New Perspectives in IC Design for Core Topics

INFORMATION

Prague, Czech Republic, Hotel NH Prague City (Mozartova 261/1, 15000 Prague Czech Republic)

PREVIOUS EDITIONS

Collaboration Models Between Taiwan and Europe for IC Design

TECIF 2024

TECIF 2024 focused on strengthening Taiwan–Europe collaboration in IC design through knowledge exchange and international partnership. The forum explored emerging IC design technologies, advanced circuit design, and system applications while addressing future technology and talent challenges.

Collaboration Models Between
Taiwan and Europe for IC Design

Cultivating Global Talent for the Future of Semiconductors

TECIF 2025

TECIF 2025 brought together leaders from industry, academia, and government to explore semiconductor innovation, talent cultivation, and Taiwan–Europe collaboration. The forum highlighted advancements in advanced packaging, silicon photonics, smart sensing, advanced devices, and emerging memory technologies.

Cultivating Global Talent for the
Future of Semiconductors

Bridging innovation,
shaping the next chapter of
chip collaboration.

Join TECIF 2026

Taiwan-Europe
Chip Innovation Forum

29-31 Oct. 2024@ Hotel NH Prague City

Email:tsri-tc@narlabs.org.tw

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